Wafer carriers in the electronics sector: the advantages of 3D printing
In the electronics sector and in the field of microelectronics, wafers are used very often; these are thin slices of semiconductor material such as silicon crystal, to produce chips or dies within integrated circuits.
Generally, their size varies from 25,4 mm to 300 mm (from 1 to 11,81 in) with a thickness of roughly 0,5 mm (0,2 in). They are made using a wire saw, obtained from an ingot of the indicated material. They are then subjected to polishing.
The wafer carriers accommodate wafers of the same size, can be produced in different materials and sizes depending on the needs and in some cases are used to support thermal processes. In this case, excellent thermal properties, good electrical insulation, reduced outgassing, and better dimensional stability are increasingly required.
Advantages and uses of PEEK
PEEK, 3D printing material available on Roboze systems, meets these needs. This super polymer is identified as suitable material for transport and storage during the production of semiconductors, as it allows to obtain dimensional stability for a much longer lifetime and a temperature range of up to 250°C. In the case of wafer carriers, a significant chemical resistance is often required, due to the processes which they are subjected to. It is for this reason that PEEK is used to replace carbon fiber reinforced PP, that is clearly less efficient, because of its poor mechanical properties and outgassing problems.
Roboze 3D printers allow to use high performance materials like PEEK, guaranteeing a precision of up to 10 micron and maximum process repeatability. While producing parts with these sizes, accuracy is extremely important as they are positioned in dedicated housings.
If you want to validate your application and are interested in receiving more information, get in touch with one of our specialized consultants, by emailing at info@roboze.com.
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